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For this case study you are going to analyze an existing print document and submit the results of your analysis to a supervisor in the form of a memo. You have been tasked by your direct supervisor...

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For this case study you are going to analyze an existing print document and submit the results of your analysis to a supervisor in the form of a memo.

You have been tasked by your direct supervisor (Sherye Latimer, Documentation Manager) to read over theBGA Manufacturer’s User Guide for Micron BGA Parts(Document 5.1

Actions). Sherye wants you to analyze the first page of the document to get a sense of the design approach that has been implemented. Once you have completed your analysis she has asked you to email her a report of your findings in 1 page memo report.

Read overDocument 5.2

Actionsfor an annotated example of a 1 page memo report and theOrganizing a MemoActionsdocument for general memo guidelines.

While conducting your analysis you may want to consider and identify the various design elements that are present in the excerpt (i.e., use of alignment, chunking, use of color, etc.). How effective are each of the elements? How might the elements be modified to improve the effectiveness of the document

Answered Same Day Aug 09, 2021

Solution

Himanshu answered on Aug 12 2021
157 Votes
Sulaiman 1
To: Shreye Latimer, Documentation Manage
From: Zaidoon Sulaiman
Subject: Customer service report - BGA Manufacture
Date: August 13, 2020
The purpose of this memo is to present my analysis of the design approach implemented for the micron BGA parts in the customer service note. The aim of the customer service note was to provide customers with the knowledge which helps them to incorporate both advanced and legacy Micron ball grid a
ay (BGA) packages into their manufacturing processes.
Summary
The overall design of the ball grid a
ay is quite good, the pins are replaced by solder balls which increases the area for connection. The use of two silicon die along with the wire bond connected to the substrate will improve the signal quality. The use of PCB substrate along to prevent overheating.
Discussion
The BGA packaging shown in the...
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