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In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature T 0 , a radiant source is used to provide a heat flux  all of...

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In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature T0, a radiant source is used to provide a heat flux  all of which is absorbed at the bonded surface. The back of the substrate is maintained at T1 while the free surface of the film is exposed to air at T and a convection heat transfer coefficient h.

(a) Show the thermal circuit representing the steady-state heat transfer situation. Be sure to label all elements, nodes, and heat rates. Leave in symbolic form.

(c) Compute and plot the required heat flux as a function of the film thickness for 0 ≤  Lƒ  ≤ 1 mm. (d) If the film is not transparent and all of the radiant heat flux is absorbed at its upper surface, determine the heat flux required to achieve bonding. Plot your results as a function of Lƒ for 0 ≤  Lƒ  ≤ 1 mm.

 

Answered Same Day Dec 25, 2021

Solution

David answered on Dec 25 2021
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